Products Information [Electronic Components / Semiconductors]

Electronic Components / Semiconductors

Bump plating

We employ integrated processing covering seed film forming of semiconductor wafers by sputtering, plating resist patterning by photolithography and bump plating. Various metals are used for plating including gold, nickel, tin, copper, lead-free solder and gold-tin alloy.
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Plating for ceramic boards

Various plating methods are applied to ceramic high heat dissipation boards to be mounted with high intensity LED, which need to be highly reliable, including penetration via filling plating, super-uniform pattern plating, electro gold plating and electroless gold plating.
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Plating for SMD terminals

Even when surface mount electronic parts are made of materials that easily react to plating solution such as ferrite and ceramics, we ensure stable quality of the terminals with neutral plating.
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Ni-hoop plating (secondary battery electlode)

We provide super-thin perforated metal that is continuously nickel plated and annealed to be used in cores of secondary batteries, such as nickel hydrogen batteries.
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TAIYO's GOAL OF RESEARCH AND DEVELOPMENT? IT IS TO CONTINUOSLY DEVELOP,COMPLETE AND PUT NEW SURFACING TECHNOLOGY IN PRACTICAL USE.

In response to the needs from the fields of electronics, mechatronics and opto-electronics, TAIYO's excellent surface finishing technology has created a number of new added values by metalizing on all types of materials. TAIYO is seeking advanced technology compatible with of the mankind and the Earth. The Research and Development Center will continue its endless effort for development of new technology so as to exactly correspond to demands of the time.

Photo: Barrel plating line for SMD terminals

Sputtering equipment
Continuous sintering furnace
Barrel plating line for SMD terminals
Plating for substrate LED
Clean room