Research & Development

Laser direct imaging system

TAIYO'S GOAL OF SURFACING TECHNOLOGY IS HIGH PRECISION PLATING ON ALL MATERIALS.

Taiyo has devoted to the technological development of the high precision plating, which is indispensable for mounting of semiconductor devices and other electric components.As a pioneer in the field, we succeeded in the processing of the solder bump plating on the silicon wafers.In the bump process of TAIYO, with our original plating devices, various metals such as gold, solder, and Pb free solder can be formed not only on the wafer but also on a printed circuit board and a ceramic base. Moreover, some former processes such as the UBM process and the Photo Lithography process are available at TAIYO.The precise function plating of Taiyo keep supporting the mounting technologies of the semiconductor parts in this rapid changing field.


  • Research and development of plated wiring

  • Fine wiring forming by plating

  • Copper hoop plating line

  • Fine texturing of mold by laser etching

page top
page top