Electronic Component

Various Plastic Products

Electronic Circuit Board

Electronic Component

Metal Parts

Plating process list
  • Bump plating Electronic Components & Semiconductors
    We employ integrated processing covering seed film forming of semiconductor wafers by sputtering, plating resist patterning by photolithography and bump plating. Various metals are used for plating including gold, nickel, tin, copper, lead-free solder and gold-tin alloy.
    Processing
    Photolithography/ Seed Film Removal
    Base plating
    Electrolytic Copper Plating/ Electrolytic Nickel Plating/ Electroless Nickel Plating
    Finish Plating
    Electrolytic gold plating/ Electrolytic tin plating/ Electrolytic gold-tin plating (alloy)/ Electrolytic tin- silver plating (alloy)/ Electroless nickel-gold plating (UBM processing)/ Electroless nickel-palladium- gold plating (UBM processing)
    • Wafer Sputtering Process
      This technology forms thin metal films on the surface of wafers and glass substrates.
      Combined with photolithography and plating processes, it enables the fabrication of fine wiring and highly reliable electronic devices.
      Processing
      Sputtering Process
    • Wafer Photolithography
      Using photolithography, we can form fine patterns on silicon and glass wafers, enabling the formation of plating resist patterns.
      Processing
      Photolithography
    • Wafer UBM Plating
      Wafer / Substrate Electroless Plating
      For wafers up to 12 inches in size and various types of substrates, we offer electroless nickel, palladium, and gold plating, as well as a wide range of plating solutions using our prototyping line.
      Finish Plating
      Electroless nickel-gold plating / Electroless nickel-palladium- gold plating
  • Plating for ceramic boards Electronic Components & Semiconductors
    Various plating methods are applied to ceramic high heat dissipation boards to be mounted with high intensity LED, which need to be highly reliable, including penetration via filling plating, super-uniform pattern plating, electro gold plating and electroless gold plating.
    Finish Plating
    Electrolytic nickel-gold plating (soft)/ Electroless nickel-gold plating/ Electroless nickel-palladium- gold plating/ Electrolytic copper plating
  • Plating for SMD terminals Electronic Components & Semiconductors
    Even when surface mount electronic parts are made of materials that easily react to plating solution such as ferrite and ceramics, we ensure stable quality of the terminals with neutral plating.
    Base plating
    Electrolytic Copper Plating/ Electrolytic Nickel Plating Finish Plating/ Electrolytic Tin Plating
    Plating Finish Plating
    Electrolytic Tin Plating
  • Prototype Hoop Plating
    We provide a wide range of plating solutions for various substrates, including metal foils, films, and nonwoven fabrics, to support research and development.
    Available Plating Options
    (Please contact us for options not listed below)
    Electrolytic Copper Plating, Electrolytic Nickel Plating, Electrolytic Tin Plating, Anti-Corrosion Treatment, Electrolytic Etching, and other processes