We employ integrated processing covering seed film forming of semiconductor wafers by sputtering, plating resist patterning by photolithography and bump plating. Various metals are used for plating including gold, nickel, tin, copper, lead-free solder and gold-tin alloy.

Various plating methods are applied to ceramic high heat dissipation boards to be mounted with high intensity LED, which need to be highly reliable, including penetration via filling plating, super-uniform pattern plating, electro gold plating and electroless gold plating.

Even when surface mount electronic parts are made of materials that easily react to plating solution such as ferrite and ceramics, we ensure stable quality of the terminals with neutral plating.

For secondary battery core material applications such as nickel-metal hydride batteries, we provide plated and annealed iron and ultra-thin perforated metals. We also offer plating for stainless steel-based materials. In addition, our prototype production line allows customers to evaluate various materials, including metals and films, along with different plating types.