| Processing Technology | Electrolytic Plating | Copper Plating |
| Nickel plating | ||
| Gold Plating | ||
| Silver Plating | ||
| Palladium Plating | ||
| Tin Plating | ||
| Gold-tin Plating | ||
| Tin-silver Plating | ||
| Electroless Plating | Copper Plating | |
| Nickel–phosphorus Plating | ||
| Nickel–boron Plating | ||
| Gold Plating | ||
| Palladium Plating | ||
| Tin Plating | ||
| Silver Plating | ||
| Hoop Plating | Nickel Plating | |
| Composite Plating | Nickel-Teflon Plating | |
| Electroforming Plating | Nickel Plating | |
| Photolithographic processing | Wafer patterning | |
| PCB patterning | ||
| Drilling | Cutting | |
| Outline Machining | ||
| NC drilling | ||
| Laser drilling | ||
| Resin molding mold | Single color resin mold | |
| 2 color resin mold | ||
| Electroforming mold | ||
| Resin molding processing | Monochrome molding | |
| 2 color molding | ||
| 3 color molding |
| Base metal, material |
Electrolytic Plating | Copper |
| Brass | ||
| Iron | ||
| Stainless steel | ||
| Kovar | ||
| Inver | ||
| Nickel | ||
| Aluminum | ||
| Titanium | ||
| Composite Metals | Copper-tungsten | |
| Copper-molybdenum | ||
| Copper-Diamond | ||
| Silver-Copper | ||
| Silver-Tungsten | ||
| Paste Metal | Copper | |
| Silver | ||
| Gold | ||
| Molybdenum-manganese | ||
| Tungsten | ||
| Plastic | ABS | |
| PCABS | ||
| Carbon | Graphite Sheet | |
| Composite Materials | ||
| Glass | Alkali-free glass | |
| Borosilicate Glass | ||
| Synthetic quartz |
| Project experience | Electrolytic Plating | Printed circuit board |
| FPC Substrate | ||
| Package Substrate | ||
| Silicon Wafers | ||
| Gallium arsenide substrate | ||
| Alumina Substrate | ||
| Aluminum nitride substrate | ||
| Silicon nitride substrate | ||
| Glass Substrate | ||
| Metal foil | ||
| Metal wire | ||
| Fiber | ||
| Piezoelectric Elements | ||
| Ceramic Capacitors |
