Electronic Circuit Board

Various Plastic Products

Electronic Circuit Board

Electronic Component

Metal Parts

Plating process list
  • Printed circuit boards Hole (NC and laser), Desmere, Photolithography, Pattern etching, Half etching (RtoR) Prited Circuit Boards
    Rigid and FPC substrates, including Galaepo, Teflon, and liquid crystal polymers. Regardless of material type, pre-plating processes such as hole opening, desmear, and photolithographic patterning can be performed.
    Rigid and FPC substrate processing
    Cutting Processing/ NC Drilling/ Laser Drilling/ Photolithography/ Pattern Etching/ Build-up Film Processing/ Plasma/ Wet Blasting
  • Electronic Circuit Boards: through-hole copper plating Prited Circuit Boards
    Through-hole copper plating, via filling copper plating, through-hole filling copper plating are applied to all types of Electronic Circuit Boards including double-sided, multilayer, buildup and flexible boards with top-class technology and on a largest scale in the industry.
    Base plating
    Through-hole copper plating/ Via filling copper plating/ Through-hole filling copper plating/ SAP・MSAP processing/ Electroless copper plating for seeding/ Black hole processing for seeding
  • Printed circuit board Electrolytic and electroless gold plating and other final surface treatment Prited Circuit Boards
    Taiyo provides final surface treatments such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. We also provide one-stop support for partial plating for the purpose of functionality and cost saving.
    Finish Plating
    Electrolytic nickel-gold plating (hard and soft)/ Electroless nickel-gold plating/ Electroless nickel-gold plating (flex)/ Electroless nickel-palladium- gold plating/ Electrolytic nickel-tin plating/ Partial electrolytic nickel-gold plating (hard and soft)/ Partial electroless nickel-palladium-gold plating