Electronic Circuit Board

Various Plastic Products

Electronic Circuit Board

Electronic Component

Metal Parts

Plating process list
    • Printed circuit boards
      Cutting process, Drilling(NC and laser), Desmere
      We provide a wide range of PCB processing services, from cutting standard-size printed circuit board materials to drilling, desmear (wet and dry), and other pre-plating processes, regardless of material, including glass-epoxy, Teflon, and liquid crystal polymer.
      Rigid PCB, Package Substrate, and FPC Processing
      Cutting Processing/ NC Drilling/ Laser Drilling/ Plasma/ Wet Blasting
    • Printed circuit boards
      Photolithography, Pattern etching
      At our company, we directly image dry film using LDI technology, enabling fine pattern formation, high-precision alignment, and short lead times.
      Rigid PCB, Package Substrate, and FPC Processing
      Photolithography/ Pattern etching
    • Printed circuit boards
      Build-up Film Processing
      Using vacuum laminators, we can laminate build-up films, as well as DFR and dry masks, which are difficult to laminate using conventional roll laminators.
      We provide solutions to meet the fine-processing needs of semiconductor package substrates and advanced electronic components.
      Rigid PCB, Package Substrate, and FPC Processing
      Build-up Film Processing
  • Electronic Circuit Boards: through-hole copper plating Prited Circuit Boards
    Through-hole copper plating, via filling copper plating, through-hole filling copper plating are applied to all types of Electronic Circuit Boards including double-sided, multilayer, buildup and flexible boards with top-class technology and on a largest scale in the industry.
    Base plating
    Through-hole copper plating/ Via filling copper plating/ Through-hole filling copper plating/ SAP・MSAP processing/ Electroless copper plating for seeding/ Black hole processing for seeding
  • Printed circuit board Electrolytic and electroless gold plating and other final surface treatment Prited Circuit Boards
    Taiyo provides final surface treatments such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. We also provide one-stop support for partial plating for the purpose of functionality and cost saving.
    Finish Plating
    Electrolytic nickel-gold plating (hard and soft)/ Electroless nickel-gold plating/ Electroless nickel-gold plating (flex)/ Electroless nickel-palladium- gold plating/ Electrolytic nickel-tin plating/ Partial electrolytic nickel-gold plating (hard and soft)/ Partial electroless nickel-palladium-gold plating
  • Printed circuit boards
    Partial gold plating
    At Taiyo, we offer selective plating for specific areas of a component. This enables us to meet specifications aimed at enhancing functionality and reducing precious metal usage.
    Finish Plating
    Partial electrolytic nickel-gold plating (hard and soft)/ Partial electroless nickel-palladium-gold plating
  • Printed circuit boards
    Half etching (RtoR)
    We offer continuous half-etching of copper materials. Copper foil is precisely etched to a specified thickness, supporting a wide range of applications, including fine circuit formation and shielding.
    FPC substrate processing
    Half etching processing