1939~

Operations began with the assembly of radio parts. In 1948, the plating business was started to handle the plating of many home appliance parts. In 1959, we developed the first fully automated zinc plating system in Japan.

1961~

We quickly started to develop technology for the plastic plating developed in the US. In 1963, we established our technology and introduced an integrated system, from mold design to plating, establishing our position as a top manufacturer.

1979~

In 1979, we started with our first automatic through-hole copper plating machine. At out peak, we had 20% of the market share in through-hole plating for printed circuit boards across Japan.

1988~

We developed the industry's first immersion bump plating machine capable of precision control, and this was the start of our move into the semiconductor industry.

1998~

In the first half of the 2000s, we achieved an overwhelming market share of 95% for plastic plating of mobile phone buttons.

2010~

As electronic devices became smaller, demand for precious metal plating for contacts and mounting inccreased. We expanded our gold plating lines to meet the growing production needs.

2013~

Following the receipt of offers from European automotive manufacturers, we expanded our operations to plastic plating of automotive parts. At present, we handle products of automakers in Japan and around the world.

2015~

We introduced direct imaging equipment and, by utilizing not only plating processes but also technologies such as patterning, we were able to meet the demands of increasingly high-density electronic components.

2018~

We expanded our plating business for electronic components to accommodate IoT. We are pursuing the possibility of new surface treatments, such as functional plating of next-generation semiconductor wafers and special coatings for on-vehicle parts.